High temperature photopolymer resin for micro-scale end use parts, withstanding temperatures up to 200°C
HT-200 is a rigid, high-performance resin that sits at the top end of the BMF material range for thermal performance. With a Heat Deflection Temperature (HDT) of 217.8°C at 0.45 MPa, it holds its shape and mechanical integrity in environments where most photopolymer resins would soften and fail. It is UV cured and heat cured during post-processing, which is what unlocks those elevated thermal properties.
The material comes in a translucent yellow colour and has a viscosity of 285 cP, making it well suited to the fine feature resolution that BMF printers are known for. It is suitable for our full range of resolutions, down to 2 microns.
HT-200 is most valuable where heat resistance, dimensional stability, and mechanical strength are all required in the same part. Common applications include:
Thermal Management Components
Housings, brackets, and insulators in electronics and power systems that must perform reliably at sustained high temperatures. HT 200 resists deformation up to 217.8°C, so components retain their geometry even in environments that would compromise standard resins.
Industrial Fixtures and Tooling
Jigs, fixtures, and inspection tools used in manufacturing processes where elevated temperatures are involved. The combination of high flexural modulus and thermal stability makes HT 200 a reliable choice for tooling that needs to maintain precise dimensions under load and heat.
Automotive and Motorsport Parts
Small under-bonnet components, sensor housings, and connectors exposed to engine bay temperatures. The automotive and motorsport sectors demand parts that perform consistently across a wide temperature range, and HT 200 handles that without secondary reinforcement.
Micro-Connectors and Electronic Housings
Fine-featured electrical connectors, PCB-mounted housings, and sensor enclosures for electronics applications where solder reflow temperatures or operational heat generation would degrade a standard resin. HT 200 holds tolerances through thermal cycling, which matters for reliable electrical assembly.
Aerospace Sub-Assemblies
Lightweight, thermally stable micro-parts for aerospace applications where dimensional accuracy through thermal cycling is critical. HT 200 offers the combination of rigidity and heat resistance needed for components that will see temperature swings in service.
Laboratory and Scientific Instruments
Components for lab instruments, analytical devices, and scientific equipment where parts may be exposed to sterilisation processes or elevated operating temperatures. The material’s dimensional stability under heat makes it well suited to controlled environments.
IPFL are the only UK provider utilising 25, 10 and 2 micron BMF technology, with in-house expertise across the full range of BMF materials. We understand the process inside out, from design for micro printing through to post-processing and quality checks, so you get parts that meet specification rather than parts that look right but fail in service.
We work with engineers at all stages, from early concept through to production volumes. If you are not sure whether HT-200 is the right material for your application, or whether a different material in the BMF range would serve you better, our team can help you work through that decision based on your actual requirements.
Get a quote for your parts or contact the team to discuss your project.
